Manuscript Deadline: July 15, 2025
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Understanding and Control Stresses in PVD Thin Films – 5/26/22

Grégory Abadias
Professor, Physics and Materials Science Department
Institut Pprime, Université de Poitiers Chasseneuil-Futuroscope, FR

Course Objectives
  • Understand the atomistic and microstructural origins of intrinsic stress development during film growth
  • Learn about the evaluation methods of stress and strain state in thin films, and their limitations
  • Provide a basic overview of stress models, including kinetics and thermodynamics concepts
  • Develop strategies to control the stress state in thin films, based on practical examples
Course Description

Thin films produced by PVD techniques are usually under a stressed state, due to the mechanical constraint imposed by the substrate. Several factors are affecting the resulting stress state, which can be either tensile or compressive, with magnitude up to several GPa. The understanding and control of stress development in thin films is essential, especially for nanoscale systems, to ensure device integrity.

The course will start with a description of residual stress sources in PVD thin films, with main focus placed on intrinsic stress. Stress evolutions during film growth and post-deposition treatments will be presented, and the underlying atomistic and microscopic mechanisms discussed. Experimental assessment of stress in thin films will be reviewed, based on recent advances in optical and X-ray diffraction techniques, allowing a depth-sensitive determination as well as real-time diagnostics. Examples will be given for polycrystalline and amorphous thin films, as well as multilayered systems. The influence of microstructure (grain size, texture) and deposition process parameters on the stress development in PVD hard coatings will be outlined. The role of energetic species, involved during magnetron sputtering or ion-beam assisted deposition, on the compressive stress build-up will be highlighted. Finally, strategies to control stress and stress engineering for specific applications will be proposed.

Course Content
  • Origin of residual stress in PVD thin films
  • Stress and strain: elasticity theory
  • Surface and interface stress effects in thin films
  • Coherence stress- Epitaxial growth
  • Experimental determination from wafer-curvature and X-ray diffraction methods and their limitations
  • Intrinsic stress evolution during polycrystalline film growth
  • Factors (working pressure, temperature, growth rate, ion bombardment…) affecting intrinsic stress
  • Selected examples of stress evolution during metal, nitride or oxide film growth
  • Stress engineering and applications

Who should attend?

This course is intended for students, young and senior scientists, engineers and others facing issues related with stress in vapor-deposited thin films and interested in gaining insights on both a fundamental and applied level.

Course Materials

Lecture notes will be provided.

Date/Time: Thursday, May 26, 8:30 a.m.-4:30 p.m.
Cost: $500 Regular/$130 Student

Advance Registration Recommended!

Cost Per Track: $300
Cost Per Module: $100

Module(s) Include: Link to Course Notes (PDF)

You may select any combination of modules during the registration process

REGISTER

Key Dates

Call for Abstracts Deadline:
November 15, 2024

Awards Nomination Deadline:
November 15, 2024

Author Notifications:
December 18, 2024

Early Registration Deadline:
March 25, 2025

Housing Deadline:
April 17, 2025

Manuscript Deadline:
July 15, 2025

Downloads

  • Code of Conduct (PDF)
  • Call for Abstracts (PDF)
  • Copyright Agreement (PDF)
  • Exhibit & Sponsor Form (PDF)

Contact

ICMCTF
Yvonne Towse

Conference Administrator
125 Maiden Lane; Suite 15B
New York, NY 10038
icmctf@icmctf.org

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